No Clean Soldering Flux Reballing Welding Flux Welding Flow Needles Rework Tools

Excellent capacity of solderstickiness
Excellent Antiwet Capacity
Widely used on BGA PGA CSP packages and Flip Chip Operation
Suitable for multiple PCB Reflow
No clean and Lead free for Environmental protection
Applicable to value ball generally used for North South bridge mobile phone chip CPU Socket value ball
For large area hand painted value balls they need to be cleaned
It is used for lattice value ball
The residue after soldering is transparent the solder ball is bright and it does not contain halogen substances

It can be applied to both reflow soldering and manual value ball processes
Clear and very clean