Flux Welding Fluxes Smd Soldering Bga Rework Station Welding Soldering Supplies

Halogen Free BGA Rework Solder Paste Mobile Phone Motherboard Flux Solder Paste

Excellent capacity of solder stickiness
Excellent Anti wet Capacity
Widely used on BGA PGA CSP packages and Flip Chip Operation
Suitable for multiple PCB Reflow
No clean and Lead free for Environmental protection
Applicable to value ball generally used for North South bridge mobile phone chip CPU Socket value ball
For large area handpainted value balls they need to be cleaned
It is used for lattice value ball

It can be applied to both reflow soldering and manual value ball processesProduct main ingredients imported rosin active agent organic solvent thickener